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HengTianMei 60/40 Rosin Core Low Temp Tin Lead Solder Wire, for Soldering Electronic Devices (1.2mm/50g)

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Product Information

  • Rosin solder wire content parameters: Tin 60% lead 40% (Sn 60% Pb 40%), rosin flux content: 1.8%.
  • Electronic solder wire product parameters: Diameter 1.2mm (0.047 inch), net weight 50g (1.76 oz), melting point around 183 ℃ (361 ℉). 
  • Low melt solder wire usage effect: A reasonable alloy content ratio and the addition of rosin flux make the solder joints firm, with a full color and luster. Excellent fluidity makes it easier for you to operate.
  • Solder wire application scope: The above characteristics make it suitable for soldering various electronic components and manual DIY operations.
  • We have a professional service team, ready to provide the best service for each customer, look forward to the start of cooperation, if you have any questions, please feel free to contact us.

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AIDAlgopix unique identifier
AIDGXZ09K001
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