Product Information
- EPO-TEK 353ND. 1lb Kit. 2 Parts A 0.91 lb + B 0.09 lb. High Temperature Epoxy Resin. Muti Application for Semiconductor, Optic Fiber, Electronic etc.
- Recommended Cure: 150°C / 1 Hour. Mix Ratio by Weight: 10 : 1. Stir Contents Before Use. Pot Life: ≤ 3 Hours (Syringe: ≤ 2 Hours). Specific Gravity: Part A: 1.20 Part B: 1.02. Shelf Life: One year at room temperature. Color (before cure): Part A: Clear, Part B: Amber. Viscosity (23°C) @ 50 rpm: 3,000 - 5,000 cPs.
- Semiconductor. Wafer-Wafer Bonding. MEMs Devices. Flip Chip Underfill. Hybrid Applications. UHV Seals. Fiber Component Packaging. Electronics Assembly. Dielectric Layer. CSP. MEM device.
- High Thermal Stability. Low Outgassing. Electrical Insulation. Versatile Application.
- Thixotropic Index: N/A. Glass Transition Temp: ≥ 90 °C. Coefficient of Thermal Expansion (CTE): Below Tg: 54 x 10⁻⁶ in/in°C. Above Tg: 206 x 10⁻⁶ in/in°C. Shore D Hardness: 85. Lap Shear @ 23°C: > 2,000 psi. Die Shear @ 23°C: ≥ 15 Kg, 5,334 psi. Degradation Temp: 412 °C. Storage Modulus: 508,298 psi. Ion Content: Cl⁻: 329 ppm NH₄⁺: 409 ppm K⁺: 5 ppm. Volume Resistivity @ 23°C: ≥ 1.8 x 10¹³ Ohm-cm. Dielectric Constant (1KHz): 3.17. Dissipation Factor (1KHz): 0.005.
